Fabric bonding polyamide resins with lowered fusion point

Details Fabric bonding polyamide resins with lowered fusion point Fabric bonding polyamide resins with lowered fusion point

1985-11-19

1987-04-28

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

428248, 528324, 528338, 5283393, 5283395, C09J 314

Patent

active

046611940

ABSTRACT:
Polyamide adhesives for bonding fabrics which allow for a lower bonding temperature than had been possible with similar previously available polyamide fabric bonding resins. The polyamide adhesives of the present invention are particularly suitable for use as fusible interliners for fabrics which demonstrate excellent retention of adhesive properties even after repeated cleaning by laundering and/or dry cleaning. The polyamide adhesive is an amidification product of

REFERENCES:
patent: 3444026 (1969-05-01), Peerman
patent: 3867248 (1975-02-01), Bauer
patent: 4196108 (1980-04-01), Hinze et al.
patent: 4566931 (1986-01-01), Panoch et al.

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