FA tool using conductor model

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C703S014000, C714S741000

Reexamination Certificate

active

07132845

ABSTRACT:
In a method and system for testing a test sample (190), a simulation program (130) is used to augment test results provided by a legacy test system (101). The legacy test system (101) includes a measuring device (110) providing a test input (112) to the test sample (190) and receiving a test output (116) from the test sample (190) in response to the test input (112). The simulation program (130) simulates the test sample (190) by predicting a simulated output (134) of the test sample (190) in response to receiving a simulated input (132). A plurality of simulated failures is simulated in the simulation program (130), with each simulated failure generating a corresponding simulated output. The simulation program (130) includes a model (140) for the measuring device (110), the model (140) providing the simulated input (132). A comparator (160) compares the test output (134) with the simulated output (134) to determine a match. The simulated failure providing the match is used to predict a predicted failure location within the test sample (190).

REFERENCES:
patent: 5349539 (1994-09-01), Moriyasu
patent: 5920830 (1999-07-01), Hatfield et al.
patent: 6073264 (2000-06-01), Nelson et al.
patent: 6249891 (2001-06-01), Matsumura et al.
patent: 6487700 (2002-11-01), Fukushima
patent: 6653848 (2003-11-01), Adamian et al.
patent: 6684169 (2004-01-01), Masella et al.
patent: 6798212 (2004-09-01), Stierman et al.
patent: 6938228 (2005-08-01), Zhong
patent: 7047174 (2006-05-01), Koh et al.
patent: 2002/0093356 (2002-07-01), Williams et al.
patent: 2005/0229121 (2005-10-01), Hildebrant
patent: 2006/0041808 (2006-02-01), Yamamura
“Comparative Time Domain Reflectometry (TDR) Analysis As A Packaging FA Tool”, Charles Odegard and Craig Lambert, ISTFA '99, The 25th International Symposium for Testing and Failure Analysis, Nov. 14-18, 1999, Santa Clara, California, (Copyrighted Paper).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

FA tool using conductor model does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with FA tool using conductor model, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and FA tool using conductor model will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3674520

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.