Extruded semiconductor package and fabrication method

Details Extruded semiconductor package and fabrication method Extruded semiconductor package and fabrication method

1981-11-27

1984-04-17

Truhe, J. V.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29588, 357 72, H05K 500

Patent

active

044436556

ABSTRACT:
A high power semiconductor package having an extruded metal housing which includes electrical terminals integrally formed with the housing and which, after assembly and encapsulation of the package, are electrically isolated by selected removal of intermediate sections of a housing wall.

REFERENCES:
patent: 3699394 (1972-10-01), Schuler
patent: 3793570 (1974-02-01), Crouch et al.
patent: 4172272 (1979-10-01), Schneider

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