Extrudable, non-flowing and non-aqueous solvent soluble hold dow

Details Extrudable, non-flowing and non-aqueous solvent soluble hold dow Extrudable, non-flowing and non-aqueous solvent soluble hold dow

1977-09-19

1979-03-06

Welsh, M. J.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

228180R, 260 18R, 260 291R, 260 312R, 260 318PQ, C08L 110

Patent

active

041430050

ABSTRACT:
Components can be held down on a printed circuit board without lead clinching by applying an extrudable, non-flowing, heat resistant completely diluent-solvent soluble composition over and around the components to keep them in place during soldering operations. After soldering, the hold down compound is removed by a solvent rinse. The hold down compound comprises a carboxylic acid, a cellulose compound, a solid hydrocarbon resin, a thickening agent, and a non-aqueous diluent-solvent.

REFERENCES:
patent: 2973499 (1961-02-01), Hammell
patent: 3230612 (1966-01-01), Potter et al.
patent: 3540718 (1970-11-01), Heffron et al.
patent: 3616533 (1971-11-01), Heap et al.
patent: 3682850 (1972-08-01), Coates
patent: 3975216 (1976-08-01), Stayner et al.
patent: 4028143 (1977-06-01), Stayner et al.
patent: 4028143 (1977-06-01), Stayner et al.
patent: 4055725 (1977-10-01), Boynton

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