Externally connected thin electronic circuit having recessed bon

Details Externally connected thin electronic circuit having recessed bon Externally connected thin electronic circuit having recessed bon

1995-08-01

1998-03-24

Graybill, David

Fishing, trapping, and vermin destroying

437183, 437203, 437205, 437207, 437211, 437219, 437226, 437947, 437981, 257784, H01L 21283, H01L 2160

Patent

active

057312222

ABSTRACT:
Recesses (46) are etched into the finished peripheral boundaries of a structure formed of a generally planar electronic circuit (40) on an upper surface (42) of a wafer (44). Bonding pads (48) are deposited in the recesses (46) and interconnected to the electronic circuit (40). External leads (52) are attached to the bonding pads (48), such that the external leads (52) lie below the plane of the electronic circuit (40).

REFERENCES:
patent: 4622574 (1986-11-01), Garcia
patent: 5146308 (1992-09-01), Chance et al.
patent: 5341027 (1994-08-01), Park et al.
patent: 5414351 (1995-05-01), Hsu et al.
patent: 5432127 (1995-07-01), Lamson et al.

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