External terminal fabrication method for semiconductor device pa

Details External terminal fabrication method for semiconductor device pa External terminal fabrication method for semiconductor device pa

1997-10-29

1999-04-20

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438106, 438108, 438126, 438615, H01L 2144, H01L 2148, H01L 2150

Patent

active

058952314

ABSTRACT:
An external terminal fabrication method for a ball grid array (BGA) semiconductor package for directly forming a bump on a substrate includes the steps of forming a plurality of conductive islands spaced from each other on an upper surface of a substrate, forming a photoresist film on the substrate, exposing the respective islands through the photoresist film, forming a conductive bump member on each of the exposed islands, and removing the photoresist film remaining on the substrate.

REFERENCES:
patent: 5466635 (1995-11-01), Lyon et al.
patent: 5639696 (1997-06-01), Liang et al.
patent: 5646068 (1997-07-01), Wilson et al.
patent: 5733802 (1998-03-01), Inoue et al.
S. Tostado and P. Hoffman, Olin Interconnect Technologies; "Solder Ball Attach Processing For Metal BGA's"; Published: 1995 IEPS Conference pp. 559-564.

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