External lead bonding method and apparatus

Details External lead bonding method and apparatus External lead bonding method and apparatus

1994-08-26

1995-12-12

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228 62, B23K 3102

Patent

active

054742285

ABSTRACT:
A bonding method and apparatus for bonding leads of a solid-state device to leads of a lead frame includes a tool arm formed with first and second bonding sections. The first bonding section bonds external leads on two opposing sides of the solid-state device to leads of the lead frame, and then the second bonding section bonds external leads on other two opposing sides of the solid-state. When these bindings are performed, the solid-state device except for the external leads is not in touch with the bonding sections that are defined by pairs of ridges.

REFERENCES:
patent: 4887758 (1989-12-01), Suzuki et al.
patent: 4979664 (1990-12-01), Lyons et al.
Jensen, "Self-Leveling Soldering Tool," IBM Tech. Discl. Bull., vol. 11, No. 8, Jan. 1969, p. 1026.

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