External-circuit connecting method and packaging structure

Details External-circuit connecting method and packaging structure External-circuit connecting method and packaging structure

1990-02-21

1991-05-28

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563066, 174117A, B32B 3100, H01B 700

Patent

active

050192019

ABSTRACT:
There is disclosed a method of connecting an external circuit, comprising including the steps of disposing between an electrode for connecting the external circuit connected with an electrode for driving a liquid crystal panel and an external circuit electrode connected with the external circuit, a film comprising an insulating resin containing conductive particles dispersed therein, and applying a pulse voltage to a heat tool under the pressure-applied state.

REFERENCES:
patent: 2487985 (1949-11-01), Ruben
patent: 4040720 (1977-08-01), York
patent: 4113981 (1978-09-01), Fujita
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4710680 (1987-12-01), Nakatani et al.
patent: 4729809 (1988-03-01), Dery et al.
patent: 4731503 (1988-03-01), Kitanishi

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