External bus interface printed circuit board routing for a ball

Details External bus interface printed circuit board routing for a ball External bus interface printed circuit board routing for a ball

1998-11-02

2000-01-04

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361780, 174261, 174262, H05K 702

Patent

active

060116951

ABSTRACT:
A top surface of the substrate may have a two-dimensional array of contact pads that are adapted to be connected to a two-dimensional array of contacts of the integrated circuit package. The contact pads may be connected to a staggered array of vias by a plurality of routing traces located on the top surface of the substrate.

REFERENCES:
patent: 4890194 (1989-12-01), Derryberry et al.
patent: 5424492 (1995-06-01), Petty et al.
patent: 5594626 (1997-01-01), Rostoker et al.
patent: 5682297 (1997-10-01), Silva

Affiliated with

Also associated with

Rating

External bus interface printed circuit board routing for a ball does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with External bus interface printed circuit board routing for a ball , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and External bus interface printed circuit board routing for a ball will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1077462