Optical: systems and elements – Glare or unwanted light reduction – With mirror
Reexamination Certificate
1999-05-17
2001-06-12
Sikder, Mohammad (Department: 2872)
Optical: systems and elements
Glare or unwanted light reduction
With mirror
C359S604000, C359S601000, C359S265000, C359S273000
Reexamination Certificate
active
06244716
ABSTRACT:
TECHNICAL FIELD
The present invention is directed to the field of exterior automotive mirrors, and more particularly to an exterior mirror sub-assembly having integrated control circuitry.
BACKGROUND ART
An exterior mirror assembly for automobiles typically includes a mirror sub-assembly with a carrier plate that holds an exterior mirror and also movably connects the mirror subassembly to other parts of the exterior mirror assembly such as an exterior mirror housing and a motor pack. Historically, exterior mirror structures usually did not include any electronic circuitry or other added features that enhance the functions of the mirror or the automobile. Such enhanced features as there were, often were driven remotely by electronic circuitry in the body of the vehicle. Recently, however, it is common to add electronic circuitry to the exterior mirror assembly to provide enhanced features, such as antennas, security lights, signal modules, heaters, electrochromic mirror elements, light sensors, and the like. For some of these enhanced features on exterior mirrors, the carrier plate provides a convenient structural support for the electronic components as well as the mirror itself in the mirror sub-assembly. Heretofore, such electronic components have been mounted on a discrete circuit board on the carrier plate and covered for protection against environmental contamination.
One problem with such mountings is that sufficient volume must be maintained in the mounting to dissipate heat generated by the circuitry. The corresponding volume consumes excessive space within the mirror housing and creates a protrusion from the rear of the carrier plate with a resultant uneven profile extending rearwardly of the carrier plate. For example, in a mirror assembly having a heater to remove ice or mist from the mirror glass, the heater is attached to a front side of the carrier plate on its own heater substrate, adjacent to the mirror glass. The motor pack, an electronic circuit board, and assorted electrical connectors between the circuit board and the heater and motor pack are mounted to the rear of the carrier plate. With this arrangement, the sub-assembly has a relatively high, uneven profile, requiring additional space in the housing to accommodate the motor pack and the limits of motion of the mirror subassembly. This profile will also interfere or displace other electronic components in the mirror housing.
Additionally, because exterior mirrors come in a wide variety of shapes, dimensions, and radii of curvature, the uneven profile caused by the differing electronic circuitry necessitates a custom-designed carrier plate for different vehicles.
SUMMARY OF THE INVENTION
An exterior automotive mirror sub-assembly according to the present invention includes a mirror element, a circuit board, and a carrier plate, wherein the circuit board is disposed in between the carrier plate and the mirror element. More particularly, the inventive structure arranges the electronic components on the circuit board such that they are disposed in space that already exists between the carrier plate and the mirror element. One possible structure includes surface-mounted electronic components placed on a flexible circuit board so that the components lie within a void typically located on the carrier plate and associated with the mounting of a motor pack. As a result, the carrier plate can be designed for near universal mounting in a variety of applications.
In one embodiment, the circuit board has a conductive track on the surface adjacent to the mirror element and electronic components on the surface opposite the mirror element. When the circuit board and the conductive track are in contact with the mirror element, the conductive track serves as a heater for the mirror element and also allows the mirror element to act as a heat sink at the same time. As a result, the inventive structure eliminates the need for providing a separate heater substrate to carry the heater.
The circuit board itself can be a flexible circuit board, which provides the lowest profile, or a rigid circuit board. The circuit board may also have protrusions for connecting the circuit board to bus bars in the mirror element or making other electrical connections, eliminating the need for soldered wire connections. One of the protrusions can be dedicated to external connections. Double-sided adhesive tape can be used to attach the circuit board and carrier plate together and can contain voids, in the form of indentations or holes, to accommodate taller electronic components.
By placing the carrier plate over the circuit board rather than beneath it and by placing the components in space that already exists between the carrier plate and the circuit board, the rear profile of the sub-assembly can be preserved to allow easy installation of the sub-assembly into the mirror housing using known components. Further, the inventive structure has a relatively low, thin profile, minimizing the amount of space that the sub-assembly occupies within the mirror housing.
Other objects, features, and advantages of the invention will be apparent from the ensuing description in conjunction with the accompanying drawings.
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Knapp Robert C.
Steenwyk Timothy E.
Gentex Corporation
Price Heneveld Cooper DeWitt & Litton
Rees Brian J.
Sikder Mohammad
LandOfFree
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