Exterior lead forming device for semiconductor devices

Details Exterior lead forming device for semiconductor devices Exterior lead forming device for semiconductor devices

1991-08-29

1993-04-06

Larson, Lowell A.

Wireworking

Crimping

72 37, B21F 100

Patent

active

051994690

ABSTRACT:
An exterior lead forming device for semiconductor devices includes a pair of roller holders rotatably attached to a punch plate. When the punch plate is lowered, the leads of a semiconductor device fixedly held on a bending die by a pressing plate are bent along the sides of the bending die. The paths of the bending rollers are monitored by a camera and path errors, calculated by a comparator, are fed back to a motor control circuit to adjust the positions of bending roller guide plates and thereby correct the path errors.

REFERENCES:
patent: 4644633 (1987-02-01), Jones et al.
patent: 4705081 (1987-11-01), Birk et al.
patent: 4817266 (1989-04-01), Holcomb

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