Extension of contact pads to the die edge via electrical...

Details Extension of contact pads to the die edge via electrical... Extension of contact pads to the die edge via electrical...

2011-07-12

2011-07-12

Ho, Tu-Tu V (Department: 2818)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Groove formation

C438S033000, C438S403000, C257S099000, C257SE33060, C257SE33065, C257SE21159, C257SE21599

Reexamination Certificate

active

07977132

ABSTRACT:
Light emitting diode (LED) dies are fabricated by forming LED layers including a first conductivity type layer, a light-emitting layer, and a second conductivity type layer. Trenches are formed in the LED layers that reach at least partially into the first conductivity type layer. Electrically insulation regions are formed in or next to at least portions of the first conductivity type layer along the die edges. A first conductivity bond pad layer is formed to electrically contact the first conductivity type layer and extend over the singulation streets between the LED dies. A second conductivity bond pad layer is formed to electrically contact the second conductivity type layer, and extend over the singulation streets between the LED dies and the electrically insulated portions of the first conductivity type layer. The LED dies are mounted to submounts and the LED dies are singulated along the singulation streets between the LED dies.

REFERENCES:
patent: 6828596 (2004-12-01), Steigerwald et al.
patent: 2004/0061123 (2004-04-01), Shelton et al.
patent: 2005/0211989 (2005-09-01), Horio et al.
patent: 2006/0273339 (2006-12-01), Steigerwald et al.
patent: 2007/0096130 (2007-05-01), Schiaffino et al.
patent: 2007/0262338 (2007-11-01), Higashi et al.
patent: 2008/0179602 (2008-07-01), Negley et al.
patent: 102007019775 (2008-10-01), None
patent: 102007046743 (2009-02-01), None
patent: 1953838 (2008-08-01), None
patent: 1956663 (2008-08-01), None
patent: 2007072967 (2007-06-01), None
Philips Lumileds U.S. Appl. No. 12/266,162, filed Nov. 6, 2008; Entitled: Series Connected Flip Chip LEDS With Growth Substrate Removed.

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