Extended thermal management

Details Extended thermal management Extended thermal management

2004-06-28

2008-12-16

Lau, Tung S (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Temperature measuring system

C702S131000, C702S132000, C374S141000, C374S166000, C374S167000, C374S170000, C374S171000, C327S512000, C327S513000, C713S320000, C713S322000, C713S323000

Reexamination Certificate

active

07467059

ABSTRACT:
A method for managing thermal condition of a thermal zone that includes multiple thermally controllable components include determining thermal relationship between the components and reducing temperature of a first component by reducing thermal dissipation of a second component.

REFERENCES:
patent: 5424767 (1995-06-01), Alavizadeh et al.
patent: 5675297 (1997-10-01), Gose et al.
patent: 6908227 (2005-06-01), Rusu et al.
patent: 2003/0109967 (2003-06-01), Cooper
patent: W0 01/03483 (2001-01-01), None
“Intel Pentium 4 Processor on 90 nm Process Thermal and Mechanical Design Guidelines”, Copyright 2004 Intel Corporation, (Feb. 2004), pp. 1-80.
Intel Processor on 90 nm Process Thermal and Mechanical Design Guidelines, Feb. 2004.

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