Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-16
1998-02-17
Tolin, Gerald P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 163, 757722, 361710, H05K 720
Patent
active
057197458
ABSTRACT:
A heat sink is provided for use with stacks of integrated circuit chips. The heat sink comprises a thermally conductive body having a recess in which the chip stack is disposed. The heat sink also includes fins which extend away from the recess. In one embodiment, fins are provided inside the recess for improved cooling of higher power chips such as a microprocessor which is surrounded by less thermally demanding memory chips.
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Agonafer Dereje
Anderson Timothy Merrill
Chrysler Gregory Martin
Chu Richard Chao-Fan
Cutter Lawrence D.
International Business Machines - Corporation
Tolin Gerald P.
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