Extended package substrate

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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11513691

ABSTRACT:
An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.

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patent: 6971887 (2005-12-01), Trobough
patent: 2003/0096514 (2003-05-01), Ho et al.
patent: 2005/0014400 (2005-01-01), Liao et al.

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