Extended package substrate

Details Extended package substrate Extended package substrate

2007-10-09

2007-10-09

Patel, Tulsidas C. (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

11513691

ABSTRACT:
An apparatus may include an integrated circuit package comprising a plurality of conductive pads and having a face, and a socket coupled to the integrated circuit package and to the conductive pads, the socket having a footprint. In some aspects, the footprint is smaller than the face.

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