Extended integration semiconductor structure with wiring layers

Details Extended integration semiconductor structure with wiring layers Extended integration semiconductor structure with wiring layers

1989-01-25

1991-10-08

Mintel, William

357 68, 357 80, H01L 2348

Patent

active

050559079

ABSTRACT:
A low cost, lightweight, fast, dense and reliable extended integration semiconductor structure is provided by forming a thin film multilayer wiring decal on a support substrate and aligning and attaching one or more integrated chips to the decal. A support ring is attached to the decal surrounding the aligned and attached integrated substrate, and the support substrate is removed. Reach-through vias connect the decal wiring to the chips.

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Active Silicon Hybrid Wafer-Scale Packaging, Richard C. Jaeger, SRC Technical Report No. T86046.

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