Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Patent
1996-09-20
1998-07-21
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
257786, 257669, 257670, 257674, 257690, 257700, 438614, 438754, 29840, 324945, 324755, H01L 2348, H01L 2954, H01L 23485
Patent
active
057838682
ABSTRACT:
Extension areas of a metal layer electrically connected to the original die bond pad allow for testing connections to be made. In this way, the connection area used for the final packaging of the die will not be damaged. The extension areas can be removed along with the testing connections. The use of perforations and/or underlayer sections can aid in the removal of the extension area. The extension area can extend over a passivation layer so that the basic die design need not be changed.
REFERENCES:
patent: 3973271 (1976-08-01), Okumura et al.
patent: 4622574 (1986-11-01), Garcia
patent: 4951098 (1990-08-01), Albergo et al.
patent: 4959706 (1990-09-01), Cusack et al.
patent: 5053850 (1991-10-01), Baker et al.
patent: 5156997 (1992-10-01), Kumar et al.
patent: 5367763 (1994-11-01), Lam
patent: 5384488 (1995-01-01), Golshan et al.
patent: 5394013 (1995-02-01), Oku et al.
patent: 5404045 (1995-04-01), Mizushima
patent: 5483741 (1996-01-01), Akram et al.
patent: 5508229 (1996-04-01), Baker
patent: 5517127 (1996-05-01), Bergeron et al.
patent: 5537254 (1996-07-01), Eytcheson et al.
patent: 5541446 (1996-07-01), Kierse
patent: 5631499 (1997-05-01), Hosomi et al.
patent: 5640762 (1997-06-01), Farnworth et al.
Integrated Device Technology Inc.
Thomas Tom
Williams Alexander Oscar
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