Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays
Patent
1994-02-03
1996-04-30
Loke, Steven H.
Active solid-state devices (e.g., transistors, solid-state diode
Gate arrays
257203, 257208, 257209, 257700, 437 48, 365226, 326 41, H01L 2710, H01L 23053
Patent
active
055127657
ABSTRACT:
A high functional capacity semiconductor based system for which the semiconductor material cost increases substantially linearly with functional capacity. The device is manufactured by taking individual, lower functional capacity devices having an extendible architecture and utilizing them in a high interconnect packaging method such as flip-chip technology. Multiple individual chips are interconnected into a single, larger device by means of this packaging technique. Because each individual chip is extendible, the resulting larger capacity device has substantially the same architecture as the smaller devices from which it is made. This means that the final device is essentially equivalent to a higher capacity single device based on the architecture of the smaller component devices. In a preferred embodiment of the invention, the result is a high capacity programmable gate array having a semiconductor cost which increases substantially linearly with the number of gates, and which uses a straightforward extension of the development tools used for application designs based on the individual chips.
REFERENCES:
patent: 4221047 (1980-09-01), Narken et al.
patent: 5239510 (1993-08-01), Hill
patent: 5275962 (1994-01-01), Hashimoto
patent: 5298805 (1994-03-01), Garverick et al.
Dobbelaere, I. et al. "Field Programmable MCM Systems--Design of an Interconnection Frame," Mar. 5, 1992 pp. 461-464, Proceedings of the IEEE 1992 Custom Integrated Circuits Conference, Boston, May 3-6, 1992.
Technology Products, C4 Product Design Manual, "vol. I: Chip and Wafer Design," pp: cover, iii through xii, 1-1 through 10-6, and A-1 through A-12, from IBM.
Loke Steven H.
National Semiconductor Corporation
LandOfFree
Extendable circuit architecture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Extendable circuit architecture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Extendable circuit architecture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-630754