Exposure system and method of manufacturing a semiconductor...

Photocopying – Projection printing and copying cameras – Focus or magnification control

Reexamination Certificate

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C355S052000, C355S067000, C355S068000, C355S072000, C355S077000

Reexamination Certificate

active

08081292

ABSTRACT:
In an exposure system and semiconductor device manufacturing method relating to the present invention, an image of spatial image mark body through a reduction projection lens is projected onto a spatial image projection plate arranged on a wafer stage by irradiating the spatial image mark body arranged on a reticle stage with an exposure light. The spatial image mark body has a plurality of spatial image marks arranged in a same plane. At projection positions of images of each spatial image mark on the spatial image projection plate, spatial image openings are equipped with differing positions in an optical axis direction of the exposure light. A focus curve with a single exposure can be obtained, without moving the wafer stage in the optical axis direction, by respective measurements of optical intensities of images of each spatial image mark through each opening thereby enabling to calculate the best focus position.

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patent: 10-254123 (1998-09-01), None

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