Exposure process and exposure device

Details Exposure process and exposure device Exposure process and exposure device

2005-03-08

2005-03-08

Nguyen, Henry Hung (Department: 2851)

Photocopying

Projection printing and copying cameras

Step and repeat

C355S067000

Reexamination Certificate

active

06864954

ABSTRACT:
To eliminate the disadvantage that determination of the alignment marks becomes difficult also in the case in which the peripheral area of the wafer is provided with alignment marks, a wafer, with a surface provided with alignment marks, and with a peripheral area provided with a singularly shaped point and to which a photoresist has been applied, is placed on a rotary stage and the edge position of the wafer and the singularly shaped point, such as a notch or the like, is determined by a device for determination of the singularly shaped point and the edge position. Based on the position information of the alignment marks formed in the wafer and based on the singularly shaped point and the edge position, a control element computes the positions of the alignment marks of the wafer which was seated on the rotary stage. Based on the above described computation result, the area which is irradiated with the exposure light and the positions of the alignment marks on the wafer are brought into agreement with one another. In this way, the photoresist which has been applied to the alignment marks is exposed. This exposure is carried out for each formation of a pattern on the substrate and thus the film formed on the alignment marks is eliminated.

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patent: 5929976 (1999-07-01), Shibuya et al.
patent: 5982474 (1999-11-01), Akiyama et al.
patent: 6052173 (2000-04-01), Miura et al.
patent: 04-291914 (1992-10-01), None
patent: 05-030349 (1993-08-01), None
patent: 06-009487 (1994-03-01), None

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