Exposure method, exposure system, and substrate processing...

Photocopying – Projection printing and copying cameras – Focus or magnification control

Reexamination Certificate

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C355S053000

Reexamination Certificate

active

07728953

ABSTRACT:
high performance and high quality micro devices, etc. are produced highly efficiently at a high throughput. Before transferring a wafer W to an exposure apparatus200for exposing the wafer W, marks formed on the wafer W is measured by an in-line measurement device400and a measurement result and/or a result of performing calculation processing on the measurement result is notified to the exposure apparatus200. In the exposure apparatus200, a measurement condition is optimized based on the notified result and an alignment processing and other processing are performed.

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