Exposure method, exposure apparatus, and method of...

Details Exposure method, exposure apparatus, and method of... Exposure method, exposure apparatus, and method of...

2006-02-21

2006-02-21

Young, Christopher G. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S678000, C428S680000, C416S24100B

Reexamination Certificate

active

07001674

ABSTRACT:
An exposure method for preventing accumulation of process error for substrates processed by an apparatus designed for multiprocessing and producing high quality semiconductor chips. A semiconductor integrated circuit production line polishes wafers of individual lots at a first processing system and second processing system of a CMP system two at a time. Wafer processing information indicating at which processing system of the first processing system and second processing system each wafer has been processed is transmitted through a communication line to a later processing apparatus including an exposure apparatus. The wafers of a lot loaded in the exposure apparatus are allocated to a plurality of processing systems of the exposure apparatus so that wafers processed by the same processing system are processed by the same processing system among the two processing systems of the exposure apparatus and are exposed at those processing systems.

REFERENCES:
patent: 6341007 (2002-01-01), Nishi et al.
patent: 2003/0152851 (2003-08-01), Ikeda
patent: 1 164 437 (2001-12-01), None
patent: A 10-163098 (1998-06-01), None

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