Exposure method and system

Details Exposure method and system Exposure method and system

2005-11-29

2005-11-29

Fuller, Rodney (Department: 2851)

Photocopying

Projection printing and copying cameras

With temperature or foreign particle control

C355S053000

Reexamination Certificate

active

06970228

ABSTRACT:
An exposure method and an exposure apparatus make it possible to easily supply a gas through which an exposure light beam is transmitted, to a space between a projection optical system and a substrate. A wafer is exposed with an image of a pattern on a reticle by radiating the exposure light beam having passed through the pattern on the reticle, onto the wafer via a projection optical system. A purge guide plate, which has a guide hole, is installed between the wafer and an optical member disposed at the tip of the projection optical system. A purge gas, through which the exposure light beam is transmitted, is supplied to the space between the wafer and the optical member. The purge gas flows through the guide hole toward the wafer, and then flows in directions toward the outer circumference.

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