Exposure method and pattern data preparation system therefor, pa

Incremental printing of symbolic information – Light or beam marking apparatus or processes – Scan of light

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

B41J 2435

Patent

active

055573142

ABSTRACT:
Selective pattern exposure with high reliability is made possible by a desired pattern of repeated pattern and a non-repeated pattern. Exposure technology is obtained to enable improvement of preparation efficiency of pattern data and to secure inspection of an aperture pattern. With the invention, an electron beam is used as focused beam, and a pattern exposure apparatus of a batch transfer system for transferring repeated pattern and non-repeated pattern of plural graphics of a semiconductor integrated circuit or the like comprises an EB drawing section for controlling the beam and irradiating beam onto a sample, a control I/O section, a drawing control section and a data storage section. In the EB drawing section, a semiconductor wafer is mounted on a platform, and in the path of the electron beam from the electron beam source to the stage, a first mask, a blanking electrode, an electron lens, a first deflector, a second deflector, a second mask and a third deflector are installed.

REFERENCES:
patent: 4585943 (1986-04-01), Yasuda et al.
patent: 4586141 (1986-04-01), Yasuda et al.
patent: 5051556 (1991-09-01), Sakamoto et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Exposure method and pattern data preparation system therefor, pa does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Exposure method and pattern data preparation system therefor, pa, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposure method and pattern data preparation system therefor, pa will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-416519

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.