Exposure method and exposure system

Details Exposure method and exposure system Exposure method and exposure system

1996-07-26

1999-12-07

Moses, Richard

Photocopying

Projection printing and copying cameras

Illumination systems or details

355 68, 355 53, G03B 2772, G03B 2774, G03B 2742

Patent

active

059992476

ABSTRACT:
An exposure system and method that can optimize the exposure of an optical resist film independent of the chemical reaction of the resist film due to optical exposure. The optimum exposure time is measured using a first optical resist film and a first semiconductor wafer, and the data thus obtained is stored in a memory. Then, a second optical resist film on a second semiconductor wafer is exposed to the same exposing light, and the intensity of the reflected light for the second resist film and the second wafer at the start of exposing is measured. The stored data of the optimum exposure time for the first resist film and the first wafer is read out, and is used as the optimum exposure time for the second resist film and the second wafer.

REFERENCES:
patent: 4952815 (1990-08-01), Nishi
patent: 5124216 (1992-06-01), Giapis et al.
patent: 5409538 (1995-04-01), Nakayama et al.
patent: 5591958 (1997-01-01), Nishi et al.
patent: 5635722 (1997-06-01), Wakamoto et al.
patent: 5646413 (1997-07-01), Nishi

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