Exposure method and apparatus

Details Exposure method and apparatus Exposure method and apparatus

1995-10-26

1997-04-22

Gonzalez, Frank

Optics: measuring and testing

By alignment in lateral direction

356401, G01B 1100

Patent

active

056233434

ABSTRACT:
In the first step of an exposure method of the present invention, an alignment optical system is arranged to oppose one of a first mask mark on a photomask and a first substrate mark on a photosensitive substrate, thereby detecting a first deviation amount between the position of the first mask mark and that of the first substrate mark. In the second step, the alignment optical system is arranged to oppose one of a second mask mark on the photomask and a second substrate mark on the photosensitive substrate, thereby detecting a second deviation mark between the position of the second mask mark and that of the second substrate mark. In the third step, correction values for minimizing the first and second deviation amounts are calculated. In the fourth step, the relative positional relationship between the image of an original pattern on the photomask and a shot area on the photosensitive substrate is adjusted on the basis of a correction value. In the fifth step, at least one of the first and second steps is executed subsequent to the fourth step to newly detect the first or second deviation amount. In the sixth step, the first to fifth steps are repeatedly executed until one of the first and second deviation amounts detected in the fifth step falls within a predetermined allowance.

REFERENCES:
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patent: 5502313 (1996-03-01), Nakamura
Pending U.S. Patent Application Ser. No. 08/422,954 of Miyazaki et al., filed Apr. 17, 1995.

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