Exposure method

Radiation imagery chemistry: process – composition – or product th – Plural exposure steps

Reexamination Certificate

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Details

C430S311000, C430S396000

Reexamination Certificate

active

07601485

ABSTRACT:
An exposure method for exposing a resist film disposed on one surface of a wafer includes a first exposure step of locating an exposure mask at a first predetermined position with respect to the wafer, and exposing the resist film. The exposure method further includes a second exposure step of displacing the exposure mask relative to the wafer by a predetermined dimension in a predetermined direction to locate the exposure mask at a second predetermined position, and exposing the resist film.

REFERENCES:
patent: 6395456 (2002-05-01), Tamada et al.
patent: 2003/0096200 (2003-05-01), Liao
patent: 2004/0219443 (2004-11-01), Spears

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