Exposure method

Details Exposure method Exposure method

2011-01-18

2011-01-18

Young, Christopher G (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Registration or layout process other than color proofing

C430S030000, C382S145000

Reexamination Certificate

active

07871745

ABSTRACT:
The invention provides an exposure method for manufacturing a device. The method includes providing a wafer having several exposure regions with a photoresist layer covering thereon. A feedback parameter map with several exposure-region feedback parameter sets respectively corresponds to the exposure regions of the wafer. At least one of the exposure-region feedback parameter sets is different from the rest of the exposure-region feedback parameter sets. According to the feedback parameter map, an exposure process is sequentially performed on each of the exposure regions of the wafer through an exposure tool to pattern the photoresist layer on the wafer. While the exposure tool performs the exposure process on each of the exposure regions, an exposure process parameter set of the exposure tool is adjusted based on the exposure-region feedback parameter sets corresponding to the exposure region in the feedback parameter map.

REFERENCES:
patent: 6873938 (2005-03-01), Paxton et al.
patent: 7006195 (2006-02-01), Raebiger et al.
patent: 7127317 (2006-10-01), Chiu et al.
patent: 2006/0192943 (2006-08-01), Roberts et al.
patent: 2004101020954 (2005-07-01), None
patent: 2004100027138 (2005-08-01), None

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