Exposure device, exposure method, and semiconductor device...

Details Exposure device, exposure method, and semiconductor device... Exposure device, exposure method, and semiconductor device...

2003-11-13

2008-11-25

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

With measuring or testing

C438S016000, C438S017000, C430S022000, C430S030000

Reexamination Certificate

active

07456031

ABSTRACT:
To provide an exposure apparatus and an exposure method able to correct an image-placement error during an exposure which is unable to decrease only by correcting electron beam description data of a mask pattern, and a semiconductor device manufacturing method used the same, wherein an image placement R2of a mask is measured at an inversion posture against an exposure posture (ST7), the measured image placement R2is corrected with considering a pattern displacement caused by gravity at the exposure posture and a first correction data Δ1is prepared based on a difference of the corrected image placement and a designed data (ST10), and an exposure is performed by deflecting charged particle beam to correct a position of a pattern to be exposed to a subject based on the first correction data Δ1(ST13).

REFERENCES:
patent: 5831272 (1998-11-01), Utsumi
patent: 5989759 (1999-11-01), Ando et al.
patent: 06-18220 (1994-01-01), None
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patent: 411265842 (1999-09-01), None
patent: 2002-270496 (2002-09-01), None
patent: 2003-297716 (2003-10-01), None
patent: 2003-318084 (2003-11-01), None
patent: WO 03/083913 (2003-10-01), None

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