Exposure condition measurement method

Details Exposure condition measurement method Exposure condition measurement method

1992-12-11

1995-07-18

Duda, Kathleen

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

430394, 430396, 430397, G03C 500

Patent

active

054340268

ABSTRACT:
In a method for measuring a condition for exposing, at a predetermined energy quantity, a pattern formed on a mask onto a photosensitive substrate on which a resist image is formed on the surface thereof by using an exposing device, first patterns formed at a plurality of positions on the mask are successively exposed onto a plurality of partial regions on the photosensitive substrate while changing said exposure condition. Second patterns are, with overlapping, exposed onto at least a portion of the latent image of said first patterns formed in said partial regions due to said process while changing the exposure condition. A predetermined state where the resist image is formed on the resist layer after the development is detected so that the exposure condition is measured in accordance with the state.

REFERENCES:
patent: 3876303 (1975-04-01), Talts
patent: 4650983 (1987-03-01), Suwa
patent: 4677301 (1987-06-01), Tanimoto et al.
patent: 4774158 (1988-09-01), Vervoordeldonk et al.
patent: 4806457 (1989-02-01), Yanagisawa
patent: 4900939 (1990-02-01), Aoyama
patent: 4908656 (1990-03-01), Suwa et al.

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