Exposure apparatus and method

Details Exposure apparatus and method Exposure apparatus and method

1998-11-24

2000-11-21

Font, Frank G.

Optics: measuring and testing

By alignment in lateral direction

356400, G01B 1100

Patent

active

06151120&

ABSTRACT:
In this exposure apparatus, a wafer formed with a first alignment mark and a mask formed with a second alignment mark at a position outside the exposure field angle are aligned. The exposure apparatus includes an alignment detection system for optically detecting any positional deviation between the first and second alignment marks, a calculator for calculating any positional deviation between a first pattern formed on the wafer and a second pattern formed on the mask on the basis of the detection result of the alignment detection system, the position of the first alignment mark in the wafer, and the position of the second alignment mark in the mask, and an actuator for driving a wafer stage on the basis of the calculation result of the calculator to make the first and second patterns overlap each other.

REFERENCES:
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patent: 4883359 (1989-11-01), Ina et al.
patent: 4901109 (1990-02-01), Mitome et al.
patent: 5323207 (1994-06-01), Ina
patent: 5559598 (1996-09-01), Matsumoto
patent: 5610718 (1997-03-01), Sentoku et al.
patent: 5682239 (1997-10-01), Matsumoto et al.

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