Photocopying – Projection printing and copying cameras – Distortion introducing or rectifying
Reexamination Certificate
1996-03-26
2001-07-31
Mahoney, Christopher E. (Department: 2851)
Photocopying
Projection printing and copying cameras
Distortion introducing or rectifying
C355S053000
Reexamination Certificate
active
06268902
ABSTRACT:
FIELD OF THE INVENTION AND RELATED ART
The present invention relates to an exposure apparatus and a method of manufacturing devices using the same.
The recent progress of semiconductor device manufacturing and fine processing related thereto are remarkable. Particularly, photolithography is mainly effected by a reduction projection exposure apparatus (stepper) having a resolution of submicrons, and a larger numerical aperture (NA) and further reduction of wavelength of the light for the exposure have been developed toward further improvement in the resolution.
A one-to-one scanning type exposure apparatus using a reflection type projection optical system has improved. For example, there are noted a reduction projection optical system incorporating a refraction element such as a lens or the like in a projection optical system to combine with a reflection element such as a mirror, or a scanning type exposure apparatus in which a reduction projection optical system constituted only by refraction elements are used, and both a mask stage and a wafer stage are moved in a speed ratio corresponding to the reduction.
As a factor influencing alignment between a mask pattern and a wafer pattern, there is a deviation of EB writing (electron beam writing) of the mask pattern (original) from a design pattern. Conventionally, the deviation has been ignored because the amount of deviation is small.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide an exposure apparatus and a method of manufacturing devices such as IC, LSI or other semiconductor devices, CCD, liquid crystal panels, magnetic heads or the like using the exposure apparatus, in which the mask pattern involving writing error can be correctly transferred onto a pattern of a member to be exposed.
According to an aspect of the present invention, there is provided an exposure apparatus having means for correcting the writing error of the pattern.
In the device manufacturing method according to an aspect of the present invention, the device pattern is transferred onto the member to be exposed using such an exposure apparatus.
According to another aspect of the present invention, means is provided to detect the pattern writing error on the basis of a position of the device pattern.
According to a further aspect of the present invention, means is provided to detect the pattern writing error on the basis of a position of the positioning mark on the mask.
According to a further aspect of the present invention, a positioning optical system for positioning the mask and the member to be exposed also functions as an optical system for detecting the writing error.
According to a further aspect of the present invention, the writing error of the pattern is corrected while scanning the mask and the member to be exposed with an exposure beam.
These and other objects, features and advantages of the present invention will become more apparent upon a consideration of the following description of the preferred embodiments of the present invention taken in conjunction with the accompanying drawings.
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Buckley “Expanding the Horizons of Optical Projection Lithography,” Solid State Technology, May 1982, pp. 77 through 82.
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Mahoney Christopher E.
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