Exposure apparatus

Photocopying – Projection printing and copying cameras – Photographing on both sides of photo-sensitive paper

Reexamination Certificate

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Details

C355S053000, C355S066000, C355S067000

Reexamination Certificate

active

11249783

ABSTRACT:
Provided is a wafer exposure apparatus used in a semiconductor device manufacturing process, the exposure apparatus including: a reflective mirror for reflecting light provided from a light source; an optical path changer for changing a path of the light provided from the reflective mirror; first mirrors installed at both sides of the optical path changer to change the path of the light; second mirrors installed at both sides of a material to change the path of the light; and third mirrors installed at both sides of a mask to enter the light reflected by the first mirrors to the mask and to enter the light passed through the mask into the second mirrors, whereby it is possible to continuously expose one surface, both surfaces or a specific surface of a wafer in a state that the wafer is once aligned.

REFERENCES:
patent: 4967088 (1990-10-01), Stengl et al.
patent: 5923403 (1999-07-01), Jain
patent: 6094305 (2000-07-01), Shiraishi
patent: 6211942 (2001-04-01), Okamoto
patent: 6229595 (2001-05-01), McKinley et al.
patent: 6700642 (2004-03-01), Mori et al.
patent: WO 9611376 (1996-04-01), None

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