Exposed pad backside pressure sensor package

Measuring and testing – Fluid pressure gauge – Mounting and connection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07900521

ABSTRACT:
A method and apparatus are described for fabricating an exposed backside pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a pressure sensor transducer die (31) from corrosive particles using a protective gel layer (38) and molding compound (39), but which vents a piezoresistive transducer sensor diaphragm (33) formed on a backside of the pressure sensor transducer die (31) through a vent hole (42) formed in an exposed die flag (36), enabling the sensor diaphragm (33) to directly sense pressure variations without the influence of a protective gel.

REFERENCES:
patent: 4656454 (1987-04-01), Rosenberger
patent: 5150438 (1992-09-01), Brown
patent: 5340993 (1994-08-01), Salina et al.
patent: 5437189 (1995-08-01), Brown et al.
patent: 5438877 (1995-08-01), Vowles et al.
patent: 5454270 (1995-10-01), Brown et al.
patent: 5465626 (1995-11-01), Brown et al.
patent: 5489800 (1996-02-01), Brown et al.
patent: 5545893 (1996-08-01), Brown et al.
patent: 5677245 (1997-10-01), Brown et al.
patent: 5889658 (1999-03-01), Sullivan et al.
patent: 6148673 (2000-11-01), Brown
patent: 6201467 (2001-03-01), Winterer et al.
patent: 6917097 (2005-07-01), Chow et al.
patent: 6949816 (2005-09-01), Brown et al.
patent: 7030469 (2006-04-01), Mahadevan et al.
patent: 7033866 (2006-04-01), Chow et al.
patent: 7060216 (2006-06-01), Schuurmans
patent: 7261003 (2007-08-01), McDonald et al.
patent: 2004/0118214 (2004-06-01), McDonald et al.
patent: 2004/0207054 (2004-10-01), Brown et al.
patent: 2005/0012183 (2005-01-01), Chow et al.
patent: 2005/0067676 (2005-03-01), Mahadevan et al.
patent: 2005/0121756 (2005-06-01), Chow et al.
patent: 2006/0082451 (2006-04-01), Shaw
patent: 2007/0222009 (2007-09-01), Kvisteroy
patent: 2007/0277623 (2007-12-01), McDonald et al.
patent: 2008/0173096 (2008-07-01), Sato et al.
patent: 69526999 (2002-10-01), None
patent: 0676628 (1995-10-01), None
patent: 0700100 (1996-03-01), None
patent: 1719993 (2005-06-01), None
patent: 05190872 (1993-07-01), None
patent: 7280681 (1995-10-01), None
patent: 8078723 (1996-03-01), None
patent: 8236805 (1996-09-01), None
patent: 09119875 (1997-05-01), None
patent: 10274580 (1998-10-01), None
patent: 200649694 (2006-02-01), None
patent: WO 98/29711 (1998-07-01), None
patent: 2008089969 (2008-01-01), None
Freescale Semiconductor, Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated, MPXV4115V, Rev. 2, May 2005.
M. Shaw, et al., “Package Design of Pressure Sensors for High Volume Consumer Applications”, STMicroelectronics, Corporate Packaging and Automation (CPA), Agrate Italy, 2008 Electronic Components and Technology Conference, pp. 834-840.
PCT Application No. PCT/US2010/021508; Search Report and Written Opinion dated Oct. 18, 2010.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Exposed pad backside pressure sensor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Exposed pad backside pressure sensor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Exposed pad backside pressure sensor package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2628635

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.