Exposed metal bezel for use in sensor devices and method...

Details Exposed metal bezel for use in sensor devices and method... Exposed metal bezel for use in sensor devices and method...

2006-12-26

2010-12-28

Landau, Matthew C (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S433000, C257SE33059

Reexamination Certificate

active

07859116

ABSTRACT:
A sensor package has a substrate. A sensor die having an inactive surface is bonded to the substrate. An active surface of the sensor die is exposed. A portion of the active surface of the sensor die has an active imaging area. A metal bezel is formed on the active surface of the sensor die and separate from the imaging area.

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patent: 2006/0050935 (2006-03-01), Bustgens et al.

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