Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-05-01
2007-05-01
Richards, N. Drew (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S124000, C438S461000
Reexamination Certificate
active
10881846
ABSTRACT:
A QFP exposed pad package which includes leads exposed within the bottom surface of the package body of the package in addition to those gull-wing leads protruding from the sides of the package body. Those leads exposed within the bottom surface of the package body are created through the utilization of a standard leadframe with additional lead features that are electrically isolated subsequent to a molding process through the use of a partial saw method.
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Amkor Technology Inc.
Richards N. Drew
Stetina Brunda Garred & Brucker
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