Explosion proof vibration resistant flat package semiconductor d

Details Explosion proof vibration resistant flat package semiconductor d Explosion proof vibration resistant flat package semiconductor d

1978-11-03

1981-06-16

James, Andrew J.

357 74, 357 68, 357 81, 357 82, H01L 2342, H01L 2344, H01L 2346

Patent

active

042741068

ABSTRACT:
Two opposite electrodes are disposed at both ends of a hollow, electrically insulating cylinder to sandwich a semiconductor element between them and connected to those ends through thin metallic annuli respectively. The semiconductor element is physically isolated from each of the metallic annuli either by an annular member interposed between a circumferential protrusion of each electrode and the hollow cylinder or by contacting directly the protrusion with the cylinder. The annulr member may be resilient or not elastically deformable.

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