Expeditious and low cost testing of RFID ICs

Details Expeditious and low cost testing of RFID ICs Expeditious and low cost testing of RFID ICs

2007-10-09

2007-10-09

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

11100040

ABSTRACT:
System and method for integrated circuit manufacturing. A preferred embodiment comprises transmitting a first set of data to integrated circuits (ICs) while they are in an on-wafer state and having each IC store the first set of data into memory, transmitting a second set of data to the ICs and having the ICs compare the second set of data with the first set of data stored in the memory, reading out the results of the comparisons, and marking an IC as being defective if the comparison indicates that that the first set of data did not match the second set of data. Each IC features an antenna formed in the scribe line region adjacent to the IC so that communications can take place while the IC remains on the wafer without the need to use electrical probes.

REFERENCES:
patent: 5153710 (1992-10-01), McCain
patent: 5448110 (1995-09-01), Tuttle et al.
patent: 5497145 (1996-03-01), Yung et al.
patent: 5572226 (1996-11-01), Tuttle
patent: 5787174 (1998-07-01), Tuttle
patent: 5983363 (1999-11-01), Tuttle et al.
patent: 6357025 (2002-03-01), Tuttle

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