Expansion plane for PQFP/TQFP IR—package design

Details Expansion plane for PQFP/TQFP IR—package design Expansion plane for PQFP/TQFP IR—package design

2007-05-08

2007-05-08

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

C257S669000, C257S678000, C438S411000, C438S612000, C438S617000

Reexamination Certificate

active

10785535

ABSTRACT:
Provided is a lead frame package with an expansion plane to minimize electrical parasitics introduced into the semiconductor chip's electrical system (e.g., power delivery system, signal loops, etc.). Also provided are methods for assembling such lead frame packages into various semiconductor packages. Generally, a lead frame package includes a down set die attach pad over an underlying bottom plate. Both the die attach pad and the bottom plate may be used as intermediary connections for either power or ground connections. As compared to conventional lead frame package having an intermediary connection, the lead frame packages of the present invention can provide for any combination of shorter wire bond lengths, more wire bond connections, improved power delivery system, or reduced amounts of electrical parasitics.

REFERENCES:
patent: 6538313 (2003-03-01), Smith
patent: 2002/0056894 (2002-05-01), Kuo et al.
patent: 2004/0159918 (2004-08-01), Lee
Thin Array Plastic Package,http://www.asat.com/products/data/tapp—0104.pdf.
Marcos Karnezos, N. Chidambaram (Raj) and Martin Goetz,Performance Enhancements in Edquad Plastic Packages,http://www.asat.com/products/dg1030.pdf.
Enhanced Leaded Packages,http://www.asat.com/products/data/EQUAD.pdf.
ASAT EDQUAD Plastic Quad Flatpack Package Reliability Assessment Report,http://www.triquint.com/company/quality/pubs/packages/97-05-edquad.pdf.

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