Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ – By gas forming or expanding
Patent
1991-10-07
1993-03-30
Kuhns, Allan R.
Plastic and nonmetallic article shaping or treating: processes
Pore forming in situ
By gas forming or expanding
264321, 2643287, B29C 6722
Patent
active
051981637
ABSTRACT:
A method of forming molded articles having consistently or partially thin-walls by expanding expandable thermoplastic resin beads in a cavity formed between molds with the application of heat. The introduction of the resin beads is carried out after causing the width of a circumference section of the cavity to be greater than the diameter of the beads by moving one of or both of the molds in at least one direction orthogonal to a direction of closing the molds, the molds are then moved back to the normal positions, and the introduced resin beads are heated to form the molded article. Also, an expansion molding apparatus having a moving device such as a cylinder which moves the molds in at least one direction orthogonal to the closing direction during the introduction of the expandable thermoplastic resin beads, whereby consistently or partially thin-walled molded articles are manufactured.
REFERENCES:
patent: 3013304 (1961-12-01), Richie et al.
patent: 3030668 (1962-04-01), Taylor
patent: 3122787 (1964-03-01), Adams
patent: 3351978 (1967-11-01), Kraus et al.
patent: 3852390 (1974-12-01), Harrison
patent: 3897899 (1975-08-01), Schuff et al.
patent: 4424180 (1984-01-01), Lalloz et al.
patent: 4758394 (1988-07-01), Yaita et al.
Harao Masaru
Takamatsu Hideo
Yamamoto Ken
Kuhns Allan R.
Sekisui Kaseihin Kogyo Kabushiki Kaisha
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