Plastic article or earthenware shaping or treating: apparatus – With mechanical means forming or expanding pores
Patent
1992-12-17
1994-07-12
Woo, Jay H.
Plastic article or earthenware shaping or treating: apparatus
With mechanical means forming or expanding pores
264 464, 264 51, 425409, 425415, 425457, B29C 6722
Patent
active
053283457
ABSTRACT:
An expansion molding apparatus for forming molded articles having consistently or partially thin-walls by expanding expandable thermoplastic resin beads in a cavity formed between molds with the application of heat. The apparatus has a moving device, for example, a cylinder which moles the molds in one orthogonal direction relative to a closing direction of the molds when filling the cavity with the expandable thermoplastic resin beads. After filling the resin beads in the cavity by moving at least one of the molds in at least one direction orthogonal to the closing direction so that a distance in a circumference section of the cavity becomes greater, the mold is moved back to the original position and the application of heat is performed to obtain molded articles.
REFERENCES:
patent: 3013306 (1961-12-01), Richie et al.
patent: 3030668 (1962-04-01), Taylor
patent: 3122787 (1964-03-01), Adams
patent: 3225124 (1965-12-01), Wallace
patent: 3651180 (1972-03-01), Glueckert
patent: 3674408 (1972-07-01), Blaumgartner et al.
patent: 3897899 (1975-08-01), Schuff et al.
patent: 4424180 (1984-01-01), Lalloz et al.
patent: 5068779 (1991-11-01), Sullivan et al.
patent: 5085814 (1992-02-01), Kamiyama et al.
Harao Masaru
Takamatsu Hideo
Yamamoto Ken
Sekisui Kaseihin Kogyo Kabushiki Kaisha
Smith Duane S.
Woo Jay H.
LandOfFree
Expansion molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Expansion molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Expansion molding apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-392529