Expansion-matched high-thermal-conductivity stress-relieved moun

Details Expansion-matched high-thermal-conductivity stress-relieved moun Expansion-matched high-thermal-conductivity stress-relieved moun

1996-10-24

1998-12-08

Healy, Brian

Coherent light generators

Particular temperature control

Heat sink

372 34, 372 43, 372 50, 372108, 372109, 257675, 347 17, 347 18, H01S 304, H01L 23495, B41J 2938

Patent

active

058480838

ABSTRACT:
A mounting module (submount) for a high-power heat-dissipating element comprises a mounting plate thermal-expansion-matched to the element, a high-thermal-conductivity bulk layer having stress-relief apertures, and an auxiliary plate bonded to the bulk layer opposite the mounting plate. The element is mounted on the mounting plate, while the bulk layer is attached to the mounting plate on the side opposite the element. The apertures accommodate the expansion of the bulk layer along a major dimension of the mounting plate. The apertures run transverse to the mounting plate, so as not to impede heat flow through the mounting plate. The apertures serve either as reservoirs for excess solder during module assembly, or as conduits for cooling fluid. The bulk layer comprises either stacked sheets having aperture sections defined prior to assembly, or blocks defining the apertures at the block interfaces. Suitable heat-dissipating elements include high-power, high-duty cycle diode lasers and laser arrays, FETs, MOPAs, thyristors, and other high-power electronic components. For a GaAs laser bar, the mounting plate can be a thin CuW or Cu/Mo plate, while the bulk layer may be made of Cu. The stress-relief allows brazing the bulk layer and the mounting plate.

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patent: 5621243 (1997-04-01), Baba et al.
patent: 5645937 (1997-07-01), Noda et al.

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