Expanded material and laminate

Details Expanded material and laminate Expanded material and laminate

2000-01-13

2000-08-29

Foelak, Morton

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

521187, 528361, B32B 326

Patent

active

061105783

ABSTRACT:
The present invention provides a biodegradable expanded material having excellent expandability, moldability, impact resistance, heat resistance and storage stability. The present invention also provides a process for the preparation of the foregoing expanded material. The present invention further provides a laminate of a non-expanded material layer and an expanded material layer prepared from the foregoing expanded material which exhibits excellent impact resistance and heat resistance and an excellent transparency in the non-expanded material even after heat treatment so that a pattern printed on the inner side of the non-expanded material layer can be clearly viewed from the outside. A novel expanded material is provided made of a hydroxycarboxylic acid based polyester having a weight-average molecular weight of from 20,000 to 400,000 comprising as structural units a structural unit derived from hydroxycarboxylic acid, a structural unit derived from molecular weight increasing agent and/or a structural unit derived from polymerization catalyst deactivator.

REFERENCES:
patent: 5314927 (1994-05-01), Kondo et al.
patent: 5321052 (1994-06-01), Taka et al.
patent: 5362765 (1994-11-01), Taka et al.
patent: 5661193 (1997-08-01), Khemani

Affiliated with

Also associated with

Rating

Expanded material and laminate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Expanded material and laminate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Expanded material and laminate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1247564