Expandable thermoplastic resin beads

Details Expandable thermoplastic resin beads Expandable thermoplastic resin beads

1989-07-24

1990-04-24

Foelak, Morton

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Cellular products or processes of preparing a cellular...

521 56, 521139, C08J 918, C08J 922

Patent

active

049201530

ABSTRACT:
A process for producing expandable thermoplastic resin beads which comprises suspending in an aqueous medium interpolymer beads comprising a polyphenylene ether resin and a polymerized vinyl aromatic monomer such as styrene, polymerizing the vinyl aromatic monomer in the presence of a polymerization catalyst to interpolymerize the vinyl aromatic monomer with the polyphenylene ether and, optionally, adding a cross-linking agent, to form interpolymerized thermoplastic resin beads, and introducing a blowing agent under pressure into the thermoplastic resin beads. The resulting resin beads have excellent foamability and molding fusability, and a foamed shaped article having superior thermal stability can be prepared from these beads.

REFERENCES:
patent: 3306874 (1967-02-01), Hay
patent: 3306875 (1967-02-01), Hay
patent: 3492249 (1970-01-01), Pezarro et al.
patent: 4234706 (1980-11-01), White
patent: 4303756 (1931-12-01), Kajimura et al.
patent: 4432692 (1984-11-01), Haitko
patent: 4442232 (1984-04-01), Kajimura et al.
patent: 4477649 (1984-10-01), Mobley
patent: 4532263 (1985-07-01), Krutchen et al.
patent: 4598100 (1986-07-01), Krutchen et al.
patent: 4598101 (1986-07-01), Krutchen et al.
patent: 4598104 (1986-07-01), Krutchen et al.

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