Expandable LED array interconnect

Details Expandable LED array interconnect Expandable LED array interconnect

2011-03-01

2011-03-01

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

Plural light emitting devices

C257S079000, C438S049000, C313S500000

Reexamination Certificate

active

07897980

ABSTRACT:
A light emitting device that can function as an array element in an expandable array of such devices. The light emitting device comprises a substrate that has a top surface and a plurality of edges. Input and output terminals are mounted to the top surface of the substrate. Both terminals comprise a plurality of contact pads disposed proximate to the edges of the substrate, allowing for easy access to both terminals from multiple edges of the substrate. A lighting element is mounted to the top surface of the substrate. The lighting element is connected between the input and output terminals. The contact pads provide multiple access points to the terminals which allow for greater flexibility in design when the devices are used as array elements in an expandable array.

REFERENCES:
patent: 6422716 (2002-07-01), Henrici et al.
patent: 6452217 (2002-09-01), Wojnarowski et al.
patent: 6498355 (2002-12-01), Harrah et al.
patent: 6501100 (2002-12-01), Srivastava
patent: 6522065 (2003-02-01), Srivastava
patent: 6653765 (2003-11-01), Levinson
patent: 6791259 (2004-09-01), Stokes
patent: 6803732 (2004-10-01), Kraus et al.
patent: 6891200 (2005-05-01), Nagai et al.
patent: 6939481 (2005-09-01), Srivastava
patent: 7008080 (2006-03-01), Bachl et al.
patent: 7055987 (2006-06-01), Staufert
patent: 7278755 (2007-10-01), Inamoto
patent: 7601550 (2009-10-01), Bogner
patent: 2002/0153529 (2002-10-01), Shie
patent: 2002/0171089 (2002-11-01), Okuyama et al.
patent: 2002/0171090 (2002-11-01), Oohata et al.
patent: 2005/0122031 (2005-06-01), Itai
patent: 2005/0253151 (2005-11-01), Sakai et al.
patent: 2006/0043406 (2006-03-01), Tsubokura et al.
patent: 2006/0163589 (2006-07-01), Fan et al.
patent: 2006/0231852 (2006-10-01), Kususe et al.
patent: 2002-050799 (2002-02-01), None
patent: 2002-076446 (2002-03-01), None
patent: 2002-531955 (2002-09-01), None
patent: 2002-531956 (2002-09-01), None
patent: 2003-318448 (2003-11-01), None
patent: WO 00/33390 (2000-06-01), None
patent: WO 03/021668 (2003-03-01), None
From related application. Japanese Patent Application No. 2006-526964, Official Notice of Rejection, mailed Feb. 16, 2010.
Patent Abstracts of Japan, Publication No. 2003-258011 dated Sep. 12, 2003.
Patent Abstracts of Japan, Publication No. 2002-093830 dated Mar. 29, 2002.
U.S. Patent Publication No. 2002/0001869 dated Jan. 3, 2002 to Fjelstad, J.
Office Action from related U.S. Appl. No. 11/656,759, mailed: Nov. 25, 2009.
Office Action from related U.S. Appl. No. 11/398,214, mailed: Dec. 11, 2009.
Office Action from related U.S. Appl. No. 10/666,399, mailed: Dec. 22, 2009.
Office Action from related U.S. Appl. No. 11/982,276, mailed: Mar. 25, 2010.
Office Action from related U.S. Appl. No. 11/827,626, mailed: Apr. 1, 2010.
Office Action from U.S. Appl. No. 11/982,276, dated May 19, 2009.
Response to Office Action from U.S. Appl. No. 11/982,276, filed Aug. 17, 2009.
Office Action from U.S. Appl. No. 11/982,276, dated Dec. 7, 2009.
Response to Office Action from U.S. Appl. No. 11/982,276, filed Feb. 5, 2010.
Office Action from U.S. Appl. No. 11/982,276, dated Feb. 18, 2010.
Response to Office Action from U.S. Appl. No. 11/982,276, filed Mar. 8, 2010.
Office Action from U.S. Appl. No. 11/982,276, dated Mar. 25, 2010.
Response to Office Action from U.S. Appl. No. 11/982,276, filed Jun. 21, 2010.
Office Action from U.S. Appl. No. 11/982,276, dated Aug. 19, 2010.
Notice on Reexamination for Chinese Patent Application No. 200580031382.3 mailed May 28, 2010.
Patent Abstracts of Japan No. 2002-050799 dated Feb. 15, 2002 to Stanley Electric Co. Ltd.
Office Action from Japanese Patent Application No. 2007-533459 (Appeal No. 200-006588) mailed Jul. 16, 2010.
Office Action from Chinese Patent Application No. 200780012387.0 mailed Jun. 30, 2010.
Summons for Oral Proceedings for European Patent Application No. 05808825.3 dated Sep. 9, 2010.

Affiliated with

Also associated with

Rating

Expandable LED array interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Expandable LED array interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Expandable LED array interconnect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2709805