Expandable bracing apparatus and method

Details Expandable bracing apparatus and method Expandable bracing apparatus and method

2007-10-02

2007-10-02

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S709000, C361S710000, C411S034000, C257S718000, C257S719000, C257S727000

Reexamination Certificate

active

10834517

ABSTRACT:
A bracing apparatus is disclosed that has a component located within an opening in a cantilevered end of a heatsink. The component has a form factor that is expandable for stabilizing the heatsink at a given elevation relative to a printed circuit board. The bracing apparatus includes a tensioning device located within an opening in the component. When deployed, the tensioning device causes the component to expand. Also included in the bracing apparatus is a coupling medium for coupling the component to the printed circuit board.

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patent: 2003/0053881 (2003-03-01), Huang et al.

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