Expand tape

Details Expand tape Expand tape

1991-12-27

1994-05-31

Sluby, P. C.

Stock material or miscellaneous articles

Composite

Of epoxy ether

428418, 428450, 4284735, 428697, 428913, 361749, 361807, B32B 1508, B32B 1504

Patent

active

053168534

ABSTRACT:
An expand tape used for dicing a semiconductor wafer includes an expandable film, and a preform layer which is provided on the expandable film and is used at die-bonding chips of the diced semiconductor wafer to a frame.

REFERENCES:
patent: 4626474 (1986-12-01), Kim
patent: 4780371 (1988-10-01), Joseph et al.
patent: 4847136 (1989-07-01), Lo
patent: 5043102 (1991-08-01), Chen et al.

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