Exhaust apparatus

Details Exhaust apparatus Exhaust apparatus

1997-05-21

2000-04-25

Beck, Shrive

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118715, 118719, 20429833, C23F 102

Patent

active

060540141

ABSTRACT:
An improved exhaust apparatus for a semiconductor process includes a chamber where the semiconductor process is performed. A load mechanism is used to carry wafers into the process chamber, and a first fan is secured to the load mechanism to carry gas dissipated from the wafers out of the load mechanism. An unload mechanism is used to carry the wafers out of the process chamber, and a second fan is secured to the unload mechanism to carry gas dissipated from the wafers out of the unload mechanism. A chassis is provided to accommodate the load mechanism, the unload mechanism and an electrical/mechanical system. An exhaust opening is located on a side panel of the chassis. An exhaust system is located inside the chassis for carrying the gasses dissipated from the load mechanism and the unload mechanism to the exhaust opening on the chassis. The exhaust system includes a first inlet secured to the first fan, a second inlet secured to the second fan, an outlet secured to the exhaust opening, and an auxiliary inlet through which heat generated from the electrical/mechanical system enters.

REFERENCES:
patent: 5088922 (1992-02-01), Kakizaki et al.
patent: 5554249 (1996-09-01), Hasegawa et al.
patent: 5900047 (1999-05-01), Rodriguez et al.
patent: 5951743 (1999-09-01), Hsieh et al.

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