Optics: measuring and testing – Dimension
Reexamination Certificate
2007-10-09
2008-11-18
Connolly, Patrick (Department: 2877)
Optics: measuring and testing
Dimension
C356S301000, C702S155000
Reexamination Certificate
active
07453584
ABSTRACT:
A structure formed on a semiconductor wafer is examined by obtaining a first diffraction signal measured from the structure using an optical metrology device. A first profile is obtained from a first machine learning system using the first diffraction signal obtained as an input to the first machine learning system. The first machine learning system is configured to generate a profile as an output for a diffraction signal received as an input. A second profile is obtained from a second machine learning system using the first profile obtained from the first machine learning system as an input to the second machine learning system. The second machine learning system is configured to generate a diffraction signal as an output for a profile received as an input. The first and second profiles include one or more parameters that characterize one or more features of the structure.
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Bao Junwei
Li Shifang
Connolly Patrick
Morrison & Foerster / LLP
Skovholt Jonathan
Timbre Technologies, Inc.
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