Refrigeration – Structural installation – With electrical component cooling
Patent
1998-03-31
1999-09-21
Doerrler, William
Refrigeration
Structural installation
With electrical component cooling
361700, 16510421, 16510433, F25D 2312, F28D 1500
Patent
active
059539305
ABSTRACT:
A thermosyphon system employs a flat evaporator which is matched to its function of cooling vertically oriented electronic circuit modules. The evaporator is connected in a thermosyphon system which facilitates air cooling and the closer spacing of electronic components whose immediate volume region is not occupied by cooling system components. The evaporator is configured to provide a uniform flow of fluid returned to it to avoid module hot spots.
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Chrysler et al., "Enhanced Thermosyphon Cooling System," IBM Technical Disclosure Bulletin vol. 37, No. 10, Oct. 1994, pp. 11-12.
Chrysler Gregory M.
Chu Richard C.
Cutter Lawrence D.
Doerrler William
International Business Machines - Corporation
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